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FR4 PCB Capability

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Items FR4 PCB
Max Layer Count 32 Layer
Min Board Thickness 5.5 mil (0.13mm) (2 L)
6.7 mil (0.17mm) (2 L)
16 mil (0.4mm) (4 L)
24 mil (0.6mm) (6 L)
32 mil (0.8mm) (8 L)
40 mil (1.2mm) (10 L)
Max Board Thickness 2L: 236mil (6mm)
≥4L: 315mil (8mm)
Max Board Dimension 24*24″ (610*610mm) 4*51″(100*1,300mm)
Max Conductor Thickness 20 OZ (27.56mil)
Min Conductor Thickness 1/2 OZ (0.7 mil)
Min Trace Width/Space Normal: 4/4 mi
Min Hole Diameter Normal: 8 mil (0.2mm) ;
Min Punch Hole Dia 0.1″ (2.5mm)
Min Hole Spacing 12 mil (0.3mm)
Max Aspect Ratio 0.417361111
Min Solder PAD Dia Normal: 14mil (0.35mm)
3mil (0.075mm)
PTH Wall Thickness 0.59mil (15um) for normal
PTH Dia Tolerance ± 3 mil (0.075mm)
NPTH Dia Tolerance ±2 mil (0.05mm)
Hole Position ±2 mil (0.05mm)
Outline Tolerance CNC: ± 6 mil (0.15mm)
Die Punch: ± 4 mil (0.1mm)
Min Soldermask Bridge 4mil(0.10mm)
Min BAG PAD Margin 5 mil (0.125mm)
Impedance Controlled Value>50 ohm: ± 10%
Value≤50 Ohm: ± 5 Ohm
Dielectric Strength > 1.3 KV /mm
Wrap & Twist ≤ 0.75%
Flammability 94V-0
Thermal Stress 3 x 10 Sec @ 280 ℃
Surface Treatment ENIG, Flash Gold, Hard Gold Finger, Gold Plating, Gold finger, Selected Gold plating,ENEPIG, ENIPIG;HAL, HASL(LF), OSP, Silver Imm., Tin Imm
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