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Items MCPCB
Max Layer Count 10 Layers
Min Board Thickness 12 mil (0.3mm)
24 mil (0.6mm)
40 mil (1.0mm)
48 mil (1.2mm)
62 mil (1.6mm)
79 mil (2.0mm)
Max Board Thickness 157 mil (4.0mm)
Max Board Dimension 24*64″(610*1,625mm)
Max Conductor Thickness 10 OZ (14mil)
Min Trace Width/Space 4/4mil (0.1/0.10mm)
Min Hole Diameter 12 mil (0.3mm)
Min Punch Hole Dia 0.12″ (3.0mm)
Min Hole Spacing 16 mil (0.4mm)
Max Aspect Ratio 12:01
Min Solder PAD Dia 14mil (0.35mm)
Min PAD Ring(Single) 3mil (0.075mm)
PTH Wall Thickness 0.48mil (12 um) for HDI; 
0.59mil (15um) for normal
PTH Dia Tolerance ± 3 mil (0.075mm)
NPTH Dia Tolerance ± 2 mil (0.05mm)
Hole Position ±3 mil (0.075mm)
Outline Tolerance CNC: ± 6 mil (015mm)
Die Punch: ± 6 mil (0.15mm)
Min Soldermask Bridge 8 mil (0.20mm)
Min BAG PAD Margin 5 mil (0.125mm)
Thermal Conductivity Normal: 0.8~1.0, 1.5
(W/m.K, or W/m.C)  High: 2.0, 3.0
Dielectric Strength >1.5 Kv (L/S >1.5mm);
>3.0 Kv (L/S >3.0mm)
Wrap & Twist ≤ 0.75%
Flammability 94V-0
Thermal Stress 3 x 10 Sec @ 280 ℃
Surface Treatment ENIG, Flash Gold, Hard Gold Finger, Gold Plating, Gold finger, Selected Gold plating,ENEPIG, ENIPIG;HAL, HASL(LF), OSP, Silver Imm., Tin Imm
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